Influences of adherent thickness, temperature and velocity on strength of adhesively-bonded single-lap joints
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摘要: 为了探讨单搭接胶接接头结构的破坏机理,采用Hopkinson拉杆实验技术,研究了板厚、温度和速度(试样端部的最大速度)对单搭接胶接接头强度的影响。实验结果表明,板越厚、温度越低、速度越大,接头的强度越大。运用有限元方法分析了胶层的应力分布,通过引入剥离应力对试样强度的影响因子,研究发现板越厚、温度越低、速度越大,剥离应力对接头强度的影响越小。Abstract: In order to explore the failure mechanism of the structures with adhesively-bonded single-lap joints, a Hopkinson tension bar technique was applied to investigate influences of adherent thickness, temperature and velocity (the maximum velocity at the end of the specimen) on the strength of this kind of joint. Experimental results show that the strengths of the specimens tested increase with the increase of the adherent thickness and velocity and the decrease of the temperature. The finite element method was adopted to analyze the stress distribution in the adhesive layer. Analysis displays that shear stress affects the strength of the specimen more dominatingly than peel stress. An influencing factor, which was the value of peel stress divided by shear stress, was introduced to further discuss the effect of peel stress on the strength of the specimen. Further discussions indicate that the effect of peel stress decreases with the increases of adherent thickness and velocity and the decrease of temperature.
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Key words:
- mechanics of explosion /
- failure mechanism /
- Hopkinson tension bar /
- single-lap joint /
- adherent thickness /
- temperature /
- velocity /
- strength
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