Effectsofpackagematerialsonperformances ofapiezoresistiveMEMSacceleromete
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摘要: 通过实验测试的方法研究分析封装材料对压阻式高量程加速度传感器性能的影响。对使用陶瓷 材料和不锈钢材料封装的加速度传感器,利用拉曼光谱仪测试研究封装前后传感器结构中残余应力和压敏 电阻阻值的变化,采用落锤、Hopkinson杆测试分析传感器的灵敏度、高过载能力,并在实弹环境中测试不同 封装传感器的测试精度的差别。实验结果显示,与陶瓷材料封装的压阻式加速度传感器相比,不锈钢材料封 装的压阻式加速度传感器在封装后结构的残余应力和压敏电阻阻值的变化更大,但不锈钢封装传感器的灵 敏度更大、高过载能力更强,同时实弹环境中可靠性和测试精度更高。Abstract: Aseriesofexperimentswerecarriedouttoexploretheeffectsofpackagematerialsonthe performancesofapiezoresistive MEMSaccelerometerunderhigh-gimpact.Fortheaccelerometers packagedwithceramicandstainlesssteel,respectively,theresidualstressandthepiezoresistancevariationweremeasuredbyusingaRamanspectrometerbeforeandafterpackage. Theirsensitivityand anti-overloadcapabilityweretestedbyapplyingaMachethammerandaHopkinsonbar,respectively. Andthetestprecisiondifferencesbetweenthetwoaccelerometerswereanalyzedinthefieldexperiment. Theexperimentalresultsshowthattheresidualstressincrementsoftheaccelerometerswith stainlesssteelpackagearehigherthanthoseoftheaccelerometerswithceramicpackageandthepiezoresistancevariationscausedbytheresidual tressesarehigher.Buttheaccelerometerswithstainlesssteelpackagehavehighersensitivitiesandbetteranti- overloadcapabilitiescomparedwiththeaccelerometerswithceramicpackage.
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