爆炸压实/扩散烧结法制备钨铜梯度材料

陈翔; 李晓杰; 缪玉松; 闫鸿浩; 王小红

doi:10.11883/bzycj-2017-0307

爆炸压实/扩散烧结法制备钨铜梯度材料

doi: 10.11883/bzycj-2017-0307

陈翔¹,
李晓杰^{1, 2, ,},
缪玉松¹,
闫鸿浩¹,
王小红¹

1.
大连理工大学工程力学系, 辽宁大连 116024
2.
大连理工大学工业装备结构分析国家重点实验室, 辽宁大连 116024

基金项目:

国家自然科学基金 11272081

国家自然科学基金 11672067

国家自然科学基金 11672068

详细信息

作者简介:
陈翔(1990-), 男, 博士研究生

通讯作者:
李晓杰, dalian03@qq.com

中图分类号: O389
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出版历程
- 收稿日期: 2017-09-03
- 修回日期: 2017-12-05
- 刊出日期: 2019-01-05

Explosive compaction-sintering of tungsten/copper gradient material

1.
Department of Engineering Mechanics, Dalian University of Technology, Dalian 116024, Liaoning, China
2.
State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, Liaoning, China

摘要

摘要: 采用爆炸压实/扩散烧结方法成功制备出高致密度的钨铜梯度材料。首先，使用机械合金化法分别制备50% W-50% Cu，75% W-25% Cu的钨铜合金粉末，并将两种合金粉末依次铺在铜板表面进行预压、通氢烧结，然后进行爆炸压实，最后对爆炸压实后的试件进行扩散烧结，得到高致密度且层间结合紧密的钨铜梯度材料。对样品分析表明，铜在钨铜颗粒间的交界面处富集，其中50% W-50% Cu层中的钨颗粒未发生长大，75% W-25% Cu层中钨与铜出现了在局部区域富集的情况，钨铜层中钨铜的含量与起始加入的钨铜粉末配比保持一致。对各钨铜层进行孔隙度检测可见，50% W-50% Cu层的孔隙度为0.04%，75% W-25% Cu层的孔隙度为0.11%。钨铜层的硬度也呈现出梯度变化，维氏硬度值在125~341之间，远大于铜基体的50。
- 爆炸压实/扩散烧结法 /
- 涂层 /
- 钨铜合金 /
- 维氏硬度 /
- X射线能谱分析
Abstract: In this study we investigated the explosive compaction-sintering for fabricating a high-density tungsten/copper alloy on a copper surface. First, 50% W-50% Cu tungsten/copper alloy powder and 75% W-25% Cu were prepared by mechanical alloying. Next, the alloy powders were pre-compacted and sintered in hydrogen atmosphere, followed by explosive compaction. Then, a high-density tungsten/copper gradient material was obtained with the coatings and the matrix tightly bonded and the copper enriched at the interfaces between the tungsten/copper particles. The tungsten grains in the 50% W-50% Cu layer did not grow, and in the 75% W-25% Cu layer the tungsten and copper were enriched in local regions. Porosity tests were carried out, the porosity of the 50% W-50% Cu layer was 0.04%, and that of the 75% W-25% Cu layer was 0.11%. The contents of tungsten and copper in the coatings were similar to the added ratio of the tungsten powder and copper powder. The hardness of the tungsten/copper gradient layer exhibited a tendency of gradient change, varying between 125-341, much bigger than 50, that of the copper.
- explosive compaction-sintering /
- coating /
- tungsten/copper alloy /
- energy dispersive spectrometer /

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图 1 材料制备流程

Figure 1. Illustration of fabrication process

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图 2 球磨前粉末扫描电镜下形貌

Figure 2. Scanning electron microscopy images of powders' microstructure before ball milling

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图 3 球磨后粉末EDS分析区域

Figure 3. EDS analysis areas of powders after ball milling

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图 4 爆炸压实装置

Figure 4. Explosive compaction device

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图 5 爆炸压实过程数值模拟

Figure 5. Simulation of explosive compaction process

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图 6 数值模拟得出的观测点压力时程曲线

Figure 6. Simulated pressure-time curves at observation points

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图 7 试件的金相照片

Figure 7. Metallographic photograph of sample

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图 8 孔隙度检测照片

Figure 8. Images of coatings in porosity test

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图 9 样品整体的背散射图

Figure 9. Backscatter image of the whole sample

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图 10 不同合金材料交界处背散射照片

Figure 10. Backscatter image of the interface between different alloy materials

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图 11 不同合金材料交界处微观背散射照片

Figure 11. Microstructure backscatter image of interface between different alloy materials

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图 12 钨铜合金层与铜层交界处背散射照片

Figure 12. Backscatter image of the interface between tungsten/copper alloy and copper

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图 13 冷压结合烧结制备出的钨铜合金材料背散射照片

Figure 13. Backscatter image of the cold pressing-sintering tungsten/copper alloy

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图 14 涂层的EDS检测区域

Figure 14. EDS analysis region of coatings

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图 15 维氏硬度测试结果

Figure 15. Variations of microhardness across the interface

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表 1 压力与材料密度之间的关系

Table 1. Relation between pressure and material density

ρ/ρ₀	p_min
0.950	2.0 σ_s (维氏硬度≈0.67)
0.990	3.1 σ_s (维氏硬度≈1.00)
0.999	4.6 σ_s (维氏硬度≈1.54)

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表 2 观测点处最大压力

Table 2. Maximum pressure at observation points

观测点	p/GPa
G1	1.65
G2	3.31
G3	3.31
G4	5.44
G5	5.44
G6	4.09
G7	3.31
G8	3.31
G9	2.97
G10	5.44
G11	5.44
G12	5.44
G13	3.31
G14	3.31
G15	3.31
G16	5.44
G17	5.44
G18	5.44

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