XIE Yushan, LU Jianhua, XU Songlin, SHU Zaiqin, ZHANG Jinyong. On impact properties of Mo-ZrC gradient metal ceramics[J]. Explosion And Shock Waves, 2023, 43(3): 033101. doi: 10.11883/bzycj-2022-0374
Citation:
QIN Feng, LI Juntao, LI Jinzhu, YANG Yingkun, GAO Lei. Analysis for impact resistance of the high-voltage power module with different fixed modes[J]. Explosion And Shock Waves, 2022, 42(5): 053204. doi: 10.11883/bzycj-2021-0269
XIE Yushan, LU Jianhua, XU Songlin, SHU Zaiqin, ZHANG Jinyong. On impact properties of Mo-ZrC gradient metal ceramics[J]. Explosion And Shock Waves, 2023, 43(3): 033101. doi: 10.11883/bzycj-2022-0374
Citation:
QIN Feng, LI Juntao, LI Jinzhu, YANG Yingkun, GAO Lei. Analysis for impact resistance of the high-voltage power module with different fixed modes[J]. Explosion And Shock Waves, 2022, 42(5): 053204. doi: 10.11883/bzycj-2021-0269
High-voltage power module is a key component to realize stable current output. In order to improve the structural reliability of the high-voltage power module and optimize the fixed modes under high-speed impact, the impact resistance characteristics with different fixed modes are studied. Based on the one-dimensional stress wave theory, the comparison of deformation energy and kinetic energy of the module with different fixed modes are obtained by analyzing the dynamic response and energy conversion form of the module on the free Hopkinson pulse bar (FHPB). The finite element method is used to simulate the processes of motion and deformation under impact velocity of 20 m/s. The stress distributions, the deflection curves, the velocity curves, and the acceleration curves of the module under the same impact are obtained. It is found that the maximum stress (427 MPa) appears at the ceramic layer, while the maximum deflection (773.8 μm) occurs at the metal substrate layer. The magnitude of the maximum displacement speed is up to 17.68 m/s, and the magnitude of the maximum acceleration is up to 51 110.7g. By comparing the impact response results of the four fixed modes, the deformation of bottom substrate from small to large is the surface mounting, four-corner point fixing, two-point fixing on the short side and two-point fixing on the long side. The highest kinetic energy and acceleration are produced on the surface mounting modules. The results indicate that a minimum failure probability exists on surface mounting module under high impact loading. In summary, surface mounting is the most reliable fixed method among the four fixed methods. Then, the selection priorities are as following: the four-corner fixing, two-point fixing on the short side and two-point fixing on the long side. Out study results would provide an important theoretical basis of the mounting and fixing methods for semiconductor high-voltage power modules in practical application.
SAMAVATIAN V, MASOUMIAN A, MAFI M, et al. Influence of directional random vibration on the fatigue life of solder joints in a power module [J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019, 9(2): 262–268. DOI: 10.1109/TCPMT. 2018.2838148.
[2]
HUANG C, WU K, WANG Z Y. Mechanical reliability testing of air-gap through-silicon vias [J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 6(5): 712–721. DOI: 10.1109/TCPMT. 2016.2544762.
[3]
SHAMMAS N Y A. Present problems of power module packaging technology [J]. Microelectronics Reliability, 2003, 43(4): 519–527. DOI: 10.1016/S0026-2714(03)00019-2.
[4]
YU Q, KIKUCHI H, IKEDA S, et al. Dynamic behavior of electronics package and impact reliability of BGA solder joints[C]//Proceedings of the 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. San Diego: IEEE, 2002: 953–960. DOI : 10.1109/ITHERM.2002.1012559.
ZHOU X. Board level lead-free solder joints reliability analysis under drop shock loading[D]. Shanghai: Shanghai Jiaotong university, 2007: 43–46.
[6]
TEE T Y, LUAN J E, PEK E, et al. Novel numerical and experimental analysis of dynamic responses under board level drop test[C]// Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems. Brussels: IEEE, 2004: 133–140. DOI: 10.1109/ESIME.2004.1304032.
[7]
WONG S F, MALATKAR P, RICK C, et al. Vibration testing and analysis of ball grid array package solder joints[C]// Proceedings of the 57th Electronic Components and Technology Conference. Sparks: IEEE, 2007: 373–380. DOI: 10.1109/ECTC.2007.373825.
JI Y Q, LI Y H, NIE F. Protection technology for onboard data storage module against high overload [J]. Journal of Vibration and Shock, 2012, 31(18): 104–106. DOI: 10.13465/j.cnki.jvs.2012.18.018.
WANG N, SHEN R Q, YIE Y H. Study on the measurement of over-loaded initiator by Hopkinson bar and numerical simulation [J]. Initiators and Pyrotechnics, 2004, 1: 42–47. DOI: 10.3969/j.issn.1003-1480.2004.01.014.
XIE Yushan, LU Jianhua, XU Songlin, SHU Zaiqin, ZHANG Jinyong. On impact properties of Mo-ZrC gradient metal ceramics[J]. Explosion And Shock Waves, 2023, 43(3): 033101. doi: 10.11883/bzycj-2022-0374
XIE Yushan, LU Jianhua, XU Songlin, SHU Zaiqin, ZHANG Jinyong. On impact properties of Mo-ZrC gradient metal ceramics[J]. Explosion And Shock Waves, 2023, 43(3): 033101. doi: 10.11883/bzycj-2022-0374